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      Ultra Low VF SMD Schottky Barrier Rectifiers Reverse V oltage: 20 to 40 Volts Forward Current: 1.0 Amp RoHS Device Halogen free Page 1 REV: A Features -Ultra high-speed switching. Mechanical data CDBA120LL-HF Thru. CDBA140LL-HF Maximum Ratings and Electrical Characteristics QW-JL019 Comchip Technology CO., LTD. Ratings at Ta=25°C unless otherwise noted. Single phase, half wave, 60Hz, resistive or inductive loaded. For capacitive load, derate current by 20% . -Low Profile surface mount applications in order to optimize board space. -Low power loss, high ef ficiency. -Hight current capability , low forward voltage drop. -Hight surge capability . -Guarding for overvoltage protection. -Silicon epitaxial planar chip,metal silicon junction. NOTES: 1. Thermal resistance from junction to ambient. 2. F=1MHZ and applied 4V DC reverse V oltage . Unit mA °C/W V V V A pF V A °C °C CDBA140LL-HF 40 28 40 -50 to +100 -50 to +150 1.0 80 130 20 1.0 CDBA130LL-HF 30 21 30 0.35 50 CDBA120LL-HF 0.33 20 14 20 Symbol VRRM VRMS VDC IFSM RθJA TSTG VF IR CJ IO TJ Typical Diode Junction Capacitance (Note 2) Reverse Current VR=VRRM TJ=100°C 8.3ms single half sine-wave superimposed VR=VRRM TJ=25°C Max. Forward Rectified Current (See Fig.1) Max. Recurrent Peak Reverse V oltage Typical Thermal Resistance (Note 1) Max. Instantaneous Forward Voltage @1.0A, TA=25°C on rated load (JEDEC method) Operating Temperature Range Max. Forward Surge Current, Storage Temperature Range Parameter Max. DC Blocking Voltage Max. Max. RMS Voltage -Case: JEDEC DO-214AC / SMA, molded plastic. -Polarity: Indicated by cathode band. -W eight: 0.055 grams -T erminals: Solder plated, Solderable per -MIL-STD-750, method 2026. -Epoxy: UL 94V -0 rate flame retardant. -Mounting position: Any. Dimensions in inches and (millimeter) DO-214AC (SMA) 0.067 (1.70) 0.047 (1.20) 0.114 (2.90) 0.083 (2.10) 0.181 (4.60) 0.157 (4.00) 0.008(0.20) 0.004(0.10) 0.012 (0.30) TYP. 0.209 (5.30) 0.185 (4.70) 0.061 (1.55) 0.030 (0.75) 0.098 (2.50) 0.067 (1.70) |